WDS-700 mobile phone special repair station features introduction:
Independent two temperature zone temperature control system:
The upper and lower temperature zones are heated by hot air, and the temperature is accurately controlled at ± 1 ℃. The upper and lower temperature zones can be heated from the top of the components and the bottom of the PCB at the same time, and 8-stage temperature control can be set at the same time to make the PCB board heated evenly.
The BGA chip and the PCB board can be simultaneously heated locally by hot air; by selection, the upper temperature zone or the lower temperature zone can be used alone, and the energy of the upper and lower heating elements can be freely combined.
Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can display four temperature curves and store multiple sets of user data at the same time, and have instant curve analysis function; external temperature measurement interface realizes precise temperature detection and can be used at any time Analyze and proofread the temperature curve of the actual collected BGA. And can carry out curve analysis, setting and correction of temperature parameters at any time on the touch screen;
Precise optical alignment system: Adopt high-definition adjustable CCD color optical vision alignment system, with functions of beam splitting, magnification, reduction, and autofocus, and equipped with automatic color difference resolution and brightness adjustment device, which can adjust the imaging clarity; with 15 "High-definition LCD display.
Multifunctional and humanized operating system
Adopt high-definition touch screen man-machine interface, integrated design of upper heating device and placement head, equipped with a variety of titanium alloy BGA nozzles, which can be rotated 360 ° at any time, easy to install and replace.
The X, Y axis and R angles are fine-adjusted with a micrometer, and the alignment is accurate with an accuracy of ± 0.01mm.
Superior safety protection function: It has an alarm function after welding or de-soldering is completed. In the case of temperature runaway, the circuit can be automatically powered off and has double over-temperature protection function. The temperature parameters are protected by password to prevent arbitrary modification and other safety protection and foolproof functions.
WDS-700 product specifications and technical parameters:
Superior function: The machine can generate corresponding temperature curves for BGA chips of different sizes.
Power supply: AC 220V ± 10% 50 / 60Hz
Total power: Max 2500W
Heater power: upper temperature zone 1200W lower temperature zone 1200W
Electrical material selection: drive motor + PLC intelligent temperature controller + true color touch screen
Temperature control: K-type thermocouple closed-loop control, independent temperature control, accuracy up to ± 1 ℃
Positioning method: laser positioning lamp + V-shaped card slot, PCB bracket can be adjusted X, Y and equipped with universal fixture
PCB size: Max140 × 160mm Min 5 × 5 mm
Applicable chip: Max 50 × 50mm Min 1 × 1 mm
Dimensions: L450 × W470 × H670mm
Temperature measurement interface: 1
Machine weight: 30kg
Appearance color: white + blue